Intel Might Have Gained Ground on TSMC’s Packaging Dominance as Booming AI Demand Overwhelms the Industry’s Undisputed Leader

With the demand for its CoWoS chip packaging technology booming, TSMC might be losing some market share to Intel, suggests data from SemiAnalysis Chipbook. CoWoS, which is short for chip-on-wafer-on-substrate (CoWoS), is a key step in the AI chip manufacturing process. It involves combining multiple…